Overview
About this event
Hot Chips has run since 1989 on the Stanford campus. It focuses on real, shipping processors rather than early research. Companies often reveal chips months before products launch, and the full detail sits on hotchips.org.
The symposium covers CPUs, GPUs, AI accelerators, memory, and networking. Presenters come from the largest names in silicon. Talks are 30-minute technical sessions rather than academic papers.
The 2026 edition runs across three days in Palo Alto. It is a hybrid event with in-person and online access. It typically draws more than 500 attendees worldwide.
What Usually Happens at Hot Chips?
The first day is dedicated to two tutorial tracks. The next two days hold keynotes and technical sessions. A poster session and awards round out the program.
Presentations focus on named, real-world chips. Recent editions covered NVIDIA, AMD, Intel, and Google silicon. Slides are published in the Hot Chips online archives.
When Is Hot Chips 2026 Taking Place?
The symposium runs August 23 to 25, 2026. Tutorials are on August 23, with the conference on August 24 and 25. Registration is open at hotchips.org/registration.
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Hot Chips 2026: Latest Updates
4 topicsSeveral details are now confirmed on the official site. These cover the program, keynote, and sponsors. Registration is open ahead of the event.
Full Technical Program Published
The advance program lists all sessions and presenters. It spans CPU, GPU, Automotive, FPGA, Memory, and Networking. Two dedicated AI sessions close the final day.
Waymo Keynote Confirmed
Daniel Rosenband of Waymo will deliver a keynote. His talk is titled "Compute in Motion: Challenges of Autonomous Driving." It runs on the afternoon of August 24.
Major Silicon Debuts Expected
The program lists talks on NVIDIA's Rubin GPU and Vera CPU. AMD will present its Instinct MI400 series architecture. Google, Meta, Microsoft, and OpenAI also have AI silicon talks.
Early Registration Deadline Set
The early registration rate runs through July 31, 2026. Registration is available for both in-person and online attendance. Payment is by credit card only.
Main Topics at Hot Chips 2026
4 topicsThe program is organised into technical sessions by chip type. Topics come directly from the official advance program. The areas below reflect the confirmed sessions.
CPUs
Two CPU sessions open the first conference day. Confirmed talks include Intel Diamond Rapids and NVIDIA's Vera CPU. IBM, Arm, and Fujitsu also present new server CPUs.
GPUs and AI Accelerators
The GPU session features NVIDIA Rubin and AMD MI400. Dedicated AI sessions cover Meta, Google, Microsoft, and OpenAI silicon. Cerebras and SambaNova present large-scale AI systems.
Memory and Interconnect
Sessions cover new memory and processing-in-memory designs. Samsung presents an LPDDR5X-PIM solution for AI inference. Networking talks include Broadcom and NVIDIA interconnect chips.
Automotive and FPGA
An automotive session covers chips for self-driving systems. Waymo and BOS Semiconductors both present here. An FPGA session features new AMD secure-compute and RF devices.
Event Experiences
4 topicsThe symposium mixes deep technical talks with community time. Each format serves a different kind of attendee. The sections below outline what to expect.
Tutorials
The first day holds two tutorial tracks. The 2026 tutorials cover memory technology and RISC-V. These give grounding before the main conference talks.
Keynotes and Technical Sessions
Keynotes anchor the two conference days. Technical sessions run as back-to-back 30-minute talks. Presenters walk through real chip architecture and trade-offs.
Poster Session
A poster session showcases newer and academic work. Eleven posters are confirmed for 2026. A Best Student Poster award is selected at the event.
Receptions and Networking
Evening receptions run after the tutorial and first conference day. These give attendees direct access to chip architects. Networking is a core reason many attend in person.
Why Hot Chips 2026 Matters
3 topicsHot Chips is where major silicon is revealed first. The talks come from the architects who designed the chips. Different groups gain different value from attending.
For Chip Architects and Hardware Engineers
The sessions detail real design trade-offs in current silicon. Engineers get architecture depth rarely shared publicly. This is a direct look at competitor and partner designs.
For AI Infrastructure Leaders
The program previews accelerators shipping in the next 18 to 24 months. This helps leaders plan compute, memory, and interconnect buys. It is an early read on the AI hardware roadmap.
For Researchers and Students
The poster session gives students a stage for new work. The Best Student Poster award adds recognition. Academic attendees can meet industry chip teams directly.
Agenda
The event runs across three days. Times follow US Pacific Time (PDT, UTC-7). The full session schedule is in the official advance program.
| Date | Programme | Location |
|---|---|---|
| Sunday, August 23 | Tutorials on memory technology and RISC-V, evening reception | Memorial Auditorium, Stanford |
| Monday, August 24 | CPU, Automotive, GPU sessions, Waymo keynote, TCMM Awards | Memorial Auditorium, Stanford |
| Tuesday, August 25 | FPGA, Memory, Networking, and two AI sessions | Memorial Auditorium, Stanford |
Following this event? Get the updates as they drop.
Registration and Access
Hot Chips 2026 requires paid registration. Both in-person and online options are available through hotchips.org/registration. Payment is by credit card only.
The early registration rate applies through July 31, 2026. Late registration stays open online through the conference dates. IEEE members and students receive discounted rates.
The exact 2026 fees are listed on the official RegFox registration page. For reference, the 2024 in-person rate was $160 for members and $200 for non-members. Refund requests are accepted through August 19, 2026, subject to a $25 fee.
Venue
Memorial Auditorium, Stanford University
The venue has hosted Hot Chips for many years. Sponsor tables are placed in the break area next to the auditorium, and online attendees join through a live and recorded video stream. San Francisco and San Jose airports both serve the area, with Stanford roughly midway between the two, and Palo Alto has Caltrain access for regional travel.
Date & Time
Aug 23–25
Starts 9:00 AM PDT
Location
Palo Alto, CA
Memorial Auditorium, Stanford University, USA
Format
Hybrid
In-person & Livestream
Memorial Auditorium, Stanford University
551 Serra Mall, Stanford, Palo Alto, CA, USA
Speakers6
Engineers shipping the work, not theorizing about it
The confirmed keynote and selected session speakers appear below. Speakers represent major chip and systems companies.
Recap: 2025 & 2024
The biggest announcements from the last 2 Hot Chips 2026 (38th Symposium on High Performance Chips) editions.
Hot Chips 2025 Recap
Hot Chips runs every August at Stanford. The 37th symposium ran August 24 to 26, 2025, at Memorial Auditorium, following the same tutorial-plus-two-day format. Full proceedings are archived on the Hot Chips 2025 site.
Main announcements included:
- Google delivered the day-one keynote
- Rapidus delivered a second keynote
- Sessions covered CPUs, optical interconnect, and machine learning silicon
- Full proceedings are archived on the Hot Chips 2025 site
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